Defect-Aware Digital Twin
We aim to develop defect-aware predictive digital twins for diverse engineering applications by creating advanced models and simulations that represent defect initiation, evolution, and their impact on material performance.
Reliability for Advanced Packaging with Defects:
We utilize computational simulations and machine learning techniques to model failure mechanisms in advanced packaging, aiming to improve the reliability predictions and performance of microelectronic devices.
Atomistic Modeling of Interfacial Cracking in Copper-To-Copper Direct Bonding
Modeling of Microstructural Evolution within TSVs Using Atomistic Simulations
A Machine Learning Framework for Preventing Cracking in Semiconductor Materials
Simulating Defects at Interfaces in Materials:
We explore the impact of various interfaces on material properties to uncover fundamental mechanisms, empowering us to design advanced materials through strategic interfacial engineering.
Effects of magnesium dopants on grain boundary migration in aluminum-magnesium alloys
Concurrent Atomistic and Continuum Methodology to Simulate Defect Dynamics:
We develop advanced multiscale simulation methods that integrate atomic and continuum scales to predict mechanical and thermal behaviors of defects in microstructurally complex materials with high efficiency and accuracy.
Concurrent atomistic and continuum simulation of strontium titanate
Ballistic-diffusive phonon heat transport across grain boundaries
Modeling Defects in Advanced Energy Materials:
The research uses advanced computational techniques to design state-of-the-art materials and structures for diverse energy applications, including Li-ion batteries.
Lithium storage mechanisms and electrochemical behavior of a molybdenum disulfide nanoparticle anode
Lithium trapping in germanium nanopores during delithiation process
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